About Our Company – PulseForge develops and manufactures non-equilibrium processing equipment utilizing cutting-edge flash lamp technology. Our core technology supports new generations of products across multiple industries, including semiconductor manufacturing, electronics, packaging, materials research, and electronics assembly for consumer and automotive products.

Your Opportunity - We are seeking a hands-on Applications Development Engineer with experience in electronics manufacturing, soldering, and design for manufacturability (DFM). In this role, you will work directly on next-generation process development, supporting both internal teams and external EMS partners. This includes optimizing photonic processes for PCB assembly, solder reflow, component attach, and substrate preparation, as well as creating robust workflows for scalable electronics production.

You’ll collaborate cross-functionally with mechanical, electrical, and software engineers to develop and validate manufacturing solutions that meet real-world production needs. The ideal candidate brings practical know-how from the EMS industry, combined with a passion for innovation and continuous process improvement. 

Responsibilities:

• Develop and optimize photonic soldering and curing applications for electronic assemblies, including SMT reflow, component bonding, and interconnect formation.
• Conduct Design of Experiments (DOE) to refine process conditions, enhance yield, and reduce cycle times.
• Collaborate with manufacturing teams to translate R&D outcomes into design-for-manufacturing (DFM) ready processes and prototypes.
• Generate detailed technical documentation, including work instructions, process flow diagrams, and application notes.
• Interface with EMS customers and contract manufacturers to support pilot runs, technical evaluations, and process troubleshooting.
• Lead and manage internal development projects from concept to validation, including system-level testing and data-driven analysis.
• Maintain laboratory safety and equipment calibration; follow cleanroom and ESD best practices where required.
• Support prototype tool qualification and participate in continuous improvement initiatives for system performance and reliability.
• Participate in external technical discussions, customer demos, and onsite installation or support visits (up to 20% travel).

Minimum Qualifications:

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field.
• 2+ years of hands-on experience in electronics manufacturing, electronics assembly, or SMT process development.
• Strong understanding of soldering processes, electronic component packaging, and assembly line integration.
• Demonstrated skills in process design, data analysis, and structured problem-solving.
• Excellent documentation, organizational, and project management abilities.

Preferred Qualifications:

• Master’s degree or equivalent experience in electronics manufacturing or process engineering.
• Familiarity with EMS workflows, DFM principles, and high-throughput electronics production lines.
• Experience with pick-and-place systems, reflow ovens, stencil printing, and optical inspection tools.
• Background in backend semiconductor packaging, photonic curing, or thin-film materials processing.
• Working knowledge of glass substrates, adhesives, and polymer materials is a plus.
• Prior experience supporting customer trials, joint development agreements, or field applications engineering roles.
• Strong verbal and written communication skills, including experience preparing customer-facing technical materials

Compensation:

Commensurate with experience

Benefits:

• 401(k)
• Dental Insurance
• Health insurance
• Paid time off
• Vision insurance 

 Please, no recruiting agencies!